Our company participates in TIE2020 Conference
Our company participates in TIE2020 – THE SPRING CONVENTION OF ELECTRONIC PACKAGING COMMUNITY on 19th-20th October 2020. The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a … Read more