Our company participates in TIE2020 – THE SPRING CONVENTION OF ELECTRONIC PACKAGING COMMUNITY on 19th-20th October 2020.
The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging.
Agenda here.
More info.
