Beia Consult announces the participation at SIITME 2016
Beia Consult announces the participation at the 2016 IEEE 22nd International Symposium on Design and Technology in Electronic Packaging (SIITME). The scientific event took place in Oradea, on October 20th–23rd, 2016. The list of topics discussed during the conference: Emerging Technologies & Trends in Advanced Packaging, Microsystems, Heterointegration, Printed Electronics, Smart Textiles, Healthcare Components, Assembling, … Read more