Beia Consult announces the participation at SIITME 2016

Beia Consult announces the participation at   the 2016 IEEE 22nd International Symposium on Design and Technology in Electronic Packaging (SIITME). The scientific event took place in Oradea, on October 20th–23rd, 2016.

The list of topics discussed during the conference:

  1. Emerging Technologies & Trends in Advanced Packaging, Microsystems, Heterointegration, Printed Electronics, Smart Textiles, Healthcare
  2. Components, Assembling, and Manufacturing Technology
  3. Design of Electronic Circuits and Systems
  4. Electronics Simulation & Modelling
  5. Electronics Applications: Optoelectronics, Advanced Communication, Automotive, Aerospace and Power Electronics
  6. Applied Reliability
  7. Challenges in Global Education

BEIA Consult attended with the following POSTER: click here